Microchip has recently released the SAMA7D65 MPU, a high-performance Arm Cortex-A7 embedded processor designed for HMI and ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

To satisfy the demand for high-density fast CMOS SRAMs, Alliance Memory has introduced a new 32Mb device in the 6mm x 8mm 48-ball FBGA package. Configured as 2M x 16, the AS7CW2M16-10BIN provides a ...

A new technical paper titled “Design of Energy-Efficient Cross-coupled Differential Photonic-SRAM (pSRAM) Bitcell for ...