Aixtron SE, Fraunhofer IISB and Bimanu Cloud Solutions are cooperating in a €28.4 million project called 'Increasing Energy ...

TrendForce says that TSMC plans to repurpose its Hsinchu Fab 5, which handles GaN production, for advanced packaging.

Infineon has announced that its scalable GaN manufacturing on 300mm wafers is on track, with first samples available for ...

The first results have been reported on a collaboration between ETH Zürich and Australia's Nuclear Science and Technology Organisation (ANSTO), looking at the impact of radiation on SiC devices for ...