Semiconductor Packaging News27m
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging
SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging: Summary The Semiconductor Industry Association pra ...
Semiconductor Packaging News35m
ITRI to exhibit wellness and smart medical innovations at CES
ITRI to exhibit wellness and smart medical innovations at CES: Summary ITRI showcases cutting-edge wellness and smart medical tech at CES 2025, including the iSleePad for sleep tr ...
Semiconductor Packaging News35m
What’s Next For Through-Silicon Vias
Summary Through-silicon vias (TSVs) enable faster, power-efficient interconnects essential for 2.5D and 3D chip packaging, reducing device size for applications like AR/VR and biomedical tech. Despite ...
Semiconductor Packaging News36m
Chip war: Chinese scientists vow to launch breakthrough RISC-V open-source CPU in 2025
Chinese scientists vow to launch breakthrough RISC-V open-source CPU in 2025: Summary China’s top research academy pledged to launch a RISC-V-based processor by 2025, ...
Semiconductor Packaging News36m
ASML CEO leads high-level delegation to TSMC next week
ASML CEO Christophe Fouquet will visit Taiwan to strengthen ties amid geopolitical shifts and U.S. export sanctions, emphasizing AI-driven growth opportunities. Digitimes Read the Full Article The ...
Semiconductor Packaging News36m
IBM and GlobalFoundries settle long-running legal cases
Summary IBM and GlobalFoundries have resolved a protracted dispute over intellectual property, breach of contract, and trade secrets through a confidential agreement. The settlement ends lawsuits and ...
Semiconductor Packaging News37m
SIA Statement on Biden Administration’s Plan to Publish ‘Export Control Framework for Artificial Intelligence Diffusion’
Summary The Semiconductor Industry Association (SIA) criticized the Biden Administration’s proposed AI export controls for their broad scope and lack of industry input, warning they could undermine U.
Semiconductor Packaging News18h
TSMC plans two more Kaohsiung fabs
Summary TSMC plans to construct two new wafer fabs in Kaohsiung next year, aiming to boost its 2-nanometer production capacity amid surging global demand. The expansion, part of a five-fab program, is ...
Semiconductor Packaging News20h
The U.S. Will Start Manufacturing Advanced Chips
Summary TSMC will begin mass production at its Arizona semiconductor fab in 2025, marking a pivotal U.S. chip manufacturing milestone. The advanced facility aims to stabilize global supply chains ...
Semiconductor Packaging News21h
ASML CEO Claims China's Semiconductor Industry is 10 to 15 Years Behind
ASML CEO Claims China's Semiconductor Industry is 10 to 15 Years Behind: Summary China's chipmakers face a 10-15 year lag due to US-led export restrictions on ASML's cutting-edge ...
Semiconductor Packaging News22h
VIEWPOINT 2025: Brian Schmaltz, Chief Operating Officer, NAMICS Corporation
NAMICS Corporation remains committed to environmental stewardship, dedicated to producing high-quality, eco-friendly ...
Semiconductor Packaging News1d
Nanoimprint Lithography Aims to Take on EUV
Summary Canon's nanoimprint lithography, unveiled in September, offers a game-changing alternative to EUV lithography. By directly stamping circuit patterns on silicon wafers, it reduces power usage, ...