Micron breaks ground on $7B HBM packaging facility in Singapore
Micron Technology (MU) said it broke ground on a new High-Bandwidth Memory, or HBM, advanced packaging facility in Singapore.
The Journal News13h
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Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total ...